Fine-pitch BGA and WiFi Module Assembly
Fine-pitch BGA and WiFi Module Assembly is a ULIKE PCBA production reference. It covers board assembly, SMT and DIP process control, component coordination, inspection, testing, and production handoff.
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Process notes
- 0.4 mm pitch BGA module soldering and Wi-Fi module assembly
- PCBA manufacturing and assembly reference
- SMT/DIP process planning and production control
- Functional verification and quality inspection support
- ESD-safe packaging and delivery preparation
DELIVERY CONTROL
Delivery attention
- Confirm the approved BOM before purchasing, especially IC, connector and BGA alternatives.
- Keep one confirmed sample as the golden sample for programming, function test and appearance comparison.
- For repeat orders, keep the same stencil, fixture, test method and packing label requirements.
PROJECT RECORD
Project record
ULIKE managed this PCBA project with attention to board construction, component placement accuracy, soldering stability, test readiness, and delivery consistency. Key technical notes include: 0.4 mm pitch BGA module soldering and Wi-Fi module assembly; PCBA manufacturing and assembly reference; SMT/DIP process planning and production control; functional verification and quality inspection support.
The work is suitable for customers that need reliable engineering review, production control, quality verification, and delivery handoff.
PROJECT IMAGES
Image record
Photos are kept as production and project references.