SMT production
- YAMAHA YSM20 / YSM10 and imported placement equipment
- Component range reference: 01005 to 150mm
- Minimum placement accuracy reference: +/-0.03mm
PCBA manufacturing capability and quality control
ULIKE connects engineering review, materials coordination, SMT placement, DIP soldering, testing and finished assembly into one controlled delivery flow.
01005Small chip placement support
0.3mmMinimum BGA pitch reference
600x320mmMaximum SMT PCB size
1-32LPCB fabrication range
Process capability
Manufacturing flow
Each production stage has a clear input, review point and output record so engineering issues are found before they become delivery risks.
- 01
Engineering review
Review Gerber, BOM, placement files, package polarity, stencil design, material substitutions and manufacturability risks.
- 02
SMT placement
Support high-speed placement, 01005 chips, BGA/CSP components, AOI inspection and reflow profile control.
- 03
DIP and post soldering
Handle through-hole insertion, wave soldering, manual soldering, connector review and power-device solder joint checks.
- 04
Testing and shipment
Coordinate programming, ICT/FCT when required, aging or sampling tests, ESD packaging, labels and shipment records.
Quality control checkpoints
Quality management
Quality control is built around repeatable records rather than a single final inspection.
Before production
- File completeness check
- BOM availability review
- Special package and polarity confirmation
- Stencil and fixture planning
During production
- First article inspection
- AOI and solder condition review
- Reflow and wave soldering process check
- BGA / connector focus inspection
After production
- Programming and functional verification
- ICT/FCT or aging test when required
- Appearance inspection
- Packing label and shipment record check
Equipment and technical range
Technical capability
ULIKE combines imported SMT placement equipment, AOI, BGA rework, reflow and wave soldering equipment for prototype and batch production.
PCB fabrication support
- 1-32 layers
- Minimum line width / spacing reference: 3.0 mil
- FR-4, high-TG, halogen-free and high-frequency materials
Inspection and test
- AOI visual inspection
- BGA rework and solder joint review
- Programming, function test and aging test support
Service coverage
Capability map
Four service directions are connected by one engineering-to-delivery system.
PCB fabrication
Multilayer PCB fabrication support with material, surface finish, stack-up and assembly handoff review.
- 1-32 layers
- High-TG and high-frequency materials
- Assembly handoff review
PCBA manufacturing
Prototype and batch PCBA production covering SMT, DIP, BGA handling, inspection, testing and packing.
- 01005 placement
- BGA and mixed assembly
- ICT/FCT support
CAD engineering
PCB layout, stack-up planning, signal and EMC review, footprint library support and DFM handoff.
- High-speed layout
- Signal and EMC review
- DFM handoff
EMS turnkey delivery
Material sourcing, finished assembly, accessory handling, functional verification, labeling and shipment coordination.
- Material sourcing
- Finished assembly
- Shipment coordination
Industry experience
Application fields
Manufacturing experience covers industrial, medical, communication, power, automotive and smart security electronics.
Industrial control
Control boards, power modules and automation equipment.
Medical electronics
Medical testing modules and equipment power assemblies.
Communication modules
Video communication boards, SDI/HDMI modules and network equipment.
Smart security
Camera mainboards, monitoring modules and finished assembly support.
Prepare a manufacturing quote
Project handoff
Send Gerber, BOM, quantity, test requirements and delivery notes. ULIKE will review manufacturability, materials and process risks before quoting.
Send Gerber, BOM, quantity, test requirements and delivery notes. ULIKE will review manufacturability, materials and process risks before quoting.
Send project details