Case Detail
Review project context, process notes, delivery attention and image records for this case.
PCBA Cases
DIP Wave Soldering Power Board
DIP Wave Soldering Power Board is a ULIKE PCBA production reference. It covers board assembly, SMT and DIP process control, component coordination, inspection, testing, and production handoff.
Ask About Similar Projects- CategoryPCBA Cases
- Project date2011-4-8 8:53:41
- Image records9
Process notes
- X-ray equipment power board processing with DIP wave soldering
- 2.00 mm board thickness
- 300 mm x 250 mm size
- 1000 g board weight
- panel with 5 embedded sub-boards
- double-sided SMT and through-hole mixed assembly
Delivery attention
- Confirm the approved BOM before purchasing, especially IC, connector and BGA alternatives.
- Keep one confirmed sample as the golden sample for programming, function test and appearance comparison.
- For repeat orders, keep the same stencil, fixture, test method and packing label requirements.
Project record
ULIKE managed this PCBA project with attention to board construction, component placement accuracy, soldering stability, test readiness, and delivery consistency. Key technical notes include: X-ray equipment power board processing with DIP wave soldering; 2.00 mm board thickness; 300 mm x 250 mm size; 1000 g board weight.
The work is suitable for customers that need reliable engineering review, production control, quality verification, and delivery handoff.
Image record
Photos are kept as production and project references.
